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Supply Chain Cost Modeling
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SavanSys Description

Activity Based Cost Modeling

SavanSys Manufacturing Library

SavanSys Inputs

SavanSys Outputs

 

OUR TECHNOLOGY

Activity Based Cost Modeling

 

Activity based cost modeling and parametric cost modeling are the two dominant cost modeling methods.  Parametric cost modeling is done by statistically analyzing a large number of actual results and creating a model that matches as closely as possible.  This “black box” approach, as an extrapolation based on historical data, is only appropriate for modeling processes that change slowly over time or cannot be decomposed into individual activities.

 

For reliable and dynamic trade offs, activity based cost modeling is the most accurate cost modeling method because individual activities are characterized and analyzed. The total cost of any manufacturing process is calculated by dividing the process into a series of activities and totaling the cost of each activity.  The cost of each activity is determined by analyzing the following attributes:

 

 

Activity based cost modeling is also well suited to comparing different technologies and manufacturing processes.  The total cost of a product can be divided into the following three categories:

 

 

The direct manufacturing cost is easy to quantify and reasonably consistent across the industry.  However, factory overhead and profit margin vary significantly between different manufacturing sites and companies.  By using activity based cost modeling, the specific differences in manufacturing cost can be determined by comparing the direct manufacturing costs. This “relative” cost modeling makes it much easier to understand the cost impacts—good or bad—of design decisions and technology tradeoffs.

SavanSys Description

 

The native SavanSys software offers the user complete flexibility and freedom throughout the modeling process. The user can import or create the board design, including the number and type of components, packaging, costs, and design rules. The software's flexible, activity-based modeling framework allows the user to define the fabrication and assembly processes as a series of steps.

 

On analysis, the software steps through the users specified fabrication and assembly processes as it simulates the production of the virtual board or module. The software tracks and displays cost and yield information at each step in the process, allowing the user to readily identify the design features that drive the time and cost.

SavanSys Inputs

 

SavanSys is designed for use early in the product lifecycle, so unlike most CAD tools it can be operated with either preliminary design data or with much more accurate design data. By performing accurate design and technology trade studies, the right design decisions can be made the first time, avoiding costly delays and design iterations.

 

SavanSys Outputs

 

The SavanSys output is a virtual prototype of the design and target manufacturing flow, and provides you with complete and comprehensive manufacturing results including the size, cost, and yield of your product. SavanSys analyses produce results in the form of specifications for an optimal product. These specifications, including technology selection, product size, product partitioning, and product cost are then used as inputs for the remained of the design and manufacturing flow. These inputs guide and constrain the design activities to avoid size and cost obstacles that could occur late in the product design flow, when making design changes is expensive and time consuming.

SavanSys Manufacturing Library

 

The SavanSys includes the following process flows. The library is always expanding and developing, with new technologies and process flows being added over time.

 

Substrate Fabrication Flows

 

 

 

 

 

 

 

 

 

 

 

Assembly Flows

Embedded Passives (PTF, ceramic paste, thin film cap., thin film res., PVD)

Embedded Actives

Flex

Inner Layer Pair

Double Sided Printed Wiring Board

Photovia Printed Wiring Board

Multilayer Printed Wiring Board

Sequential Lamination

Laser Drilled Via

Flip chip substrates

Wire bond substrates

Mixed Technology (SMT, through-hole, wire bond, TAB, flip chip)

Test and Rework

Adhesive Flip Chip

Solder TAB

Metallurgical Flip Chip

Wire Bond

Through-hole

Single-sided Surface Mount

Double-sided Surface Mount

Paste-in-Hole

Lead Free

Manual Assembly

Small Discretes (0201 & 01005)

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