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Supply Chain Cost Modeling
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WAFER LEVEL PACKAGING (WLP) COST MODEL

Quickly see the cost impact of design decisions

 

 

An optional enhancement is to create a model calibrated to your particular technology or to a specific supplier (internal or external). Contact us for more details.

 

Use the model to:

 

What’s the cost impact of...?

 

WLP Model Parameter List

Design

Process Parameters

Pkg Size

Manufacturing Location

Pkg I/O

Equipment Up Time

Number of RDLs

Equipment Utilization

Die Preparation options

Reconstituted Wafer Diameter (mm)

Solder Ball Size

Polishing

Solder Ball material

Backside Lamination

Passivation material

Overhead & Profit Margin

Polymer Thickness

 

Through Mold Via options

 

 

 

 

 

 

 

 

 

 

 

 

 

Complex Calculations, Simple Interface

 

All of our Packaging Cost Models were developed for ease of use and efficiency. Many detailed parameters are available for editing, but only a few inputs are required to run the analysis. For parameters you choose not to edit yourself, complex SavanSys algorithms automatically assign default values based on your other entries and extensive, up-to-date industry knowledge.